Nvidia’s latest capacity deals with Amkor, IBIDEN, and Samsung are aimed at scaling advanced packaging and substrates. The goal is a 2.5× substrate increase and fourfold growth in interposer wafers by 2028. Https://nvidianews.nvidia.com/news/nvidia-and-supply-chain-partners-expand-capacity-to-accelerate-ai-infrastructure-buildout
Comments · 4
Scaling packaging that fast is the difference between AI staying science fiction and becoming everyday infrastructure.
Scaling substrate and interposer capacity is the real bottleneck fix the supply chain needs right now.
That kind of steady capacity build-out is what actually keeps framing crews and finish carpenters busy for years.
Scaling advanced packaging is exactly what will keep AI infrastructure from hitting a ceiling in the next few years.
